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We build helium leak test machines, helium leak detection systems.: We build helium leak test machines, helium leak detection systems and other vacuum systems for leak testing, helium leak detection, pressure decay and vacuum decay, pressure testing, vacuum drying, vacuum
Dynalab Test Systems: Dynalab NX Wire Harness Testers are used by some of the world's largest manufacturers of wire harnesses. NX Wire Harness Testers are fast, accurate, easy to program, and networkable.
EADS TEST & SERVICES: EADS TEST & SERVICES is a specialist in Automatic Testing and offers a line of test systems and services for the integration, production and maintenance testing of electronic, electro-optic and
Exatron: Test handler manufacture
Advanced Board Test Software for Manufacturing, Board Bring-Up, and In-Field Testing: Kozio is the world leader in embedded system level test for processor boards using various processor architectures. Kozio provides turnkey test applications that are delivered fully ported to custom platforms.
TOOLTRONICS, Inc: Manufactures Kelvin test sockets and burn-in sockets for the semiconductor industry and DC-DC power converter manufacturer.
The Micromanipulator Co., Inc: A manufacturer of analytical probing equipment including manual, semiautomatic, automatic and sub .2 micron probe stations. A line of accessories including software, optics, thermal chucks, probes an...
Interconnect Devices, Inc: Probes and receptacles for the ATE industry.
Gentec International S.A. (GISA): Provides spring probes and rigid pins for automatic testing of bare and loaded circuit boards.
Feinmetall GmbH: Manufactures contact probes and test adapters for testing printed circuit boards and subassemblies and probe cards for semiconductor testing.
Connect2it, LLC: Spring probes, pogo probes BGA, PGA, LGA probes and fine interconnects, conductive elastomers, micro test clips, switch probes, automotive probes, automation test systems and pin loaders. (Pop-ups and...
Peak Automation: Peak Automations primary product is automated handling equipment for the semiconductor and electronics processing industry. The majority of this equipment is used for semiconductor test handling and packaging.
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Tyco Electronics to Present at Credit Suisse 2008 Annual Technology Conference: Tyco Electronics Ltd. today announced that Chief Executive Officer Tom Lynch will present at Credit Suisse's 2008 Annual Technology Conference in Scottsdale, Ariz. on Dec. 3, 2008 at 10:00 a.m. PST.
An audio webcast of the presentation will be available...
Carrier Acquires Noresco to Expand Energy Solutions Capabilities: Carrier Corp., the world's largest provider of heating, ventilation, air-conditioning and refrigeration solutions, and a unit of United Technologies Corp. (NYSE: UTX), has acquired Noresco, a leading independent energy services company. The acquisition was...
ARRIS to Present at UBS Global Technology and Services Conference: ARRIS (Nasdaq: ARRS) a global telecommunications technology leader, today announced that Company management will present at the UBS Global Technology and Services Conference at the Grand Hyatt New York on Wednesday, November 19, 2008 at approximately 10:30...
SiliconExpert Technologies Releases Component Risk Analysis and Obsolescence Forecast Algorithm: SANTA CLARA, CA, Nov 18th. SiliconExpert Technologies, the leading provider and innovator of electronic parts management, in collaboration with University of Maryland’s CALCE, has released its component risk analysis and obsolescence forecast algorithm for...
KEMET Featuring First-to-Market Capacitance Products at Electronica 2008: KEMET Corporation (NYSE: KEM), The Capacitance Company, is showcasing a company-record number of first-to-market capacitance products this week at Electronica 2008 in Munich, Germany. In the quarter ending September 30, 2008, KEMET has introduced 178 first...
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