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Aspen Technologies: Aspen Technologies is the preferred supplier of advanced packaging and assembly services. From engineering prototypes to volume production, custom MEMS packages to Flip Chip assembly, finest-pitch wedge and gold ball
Excess Inventory: Mitkem Technologies, Inc. was established in February of 1999. A devotion to customer service and a strong work ethic has fueled Mitkem since her inception. Mitkem Technologies found its beginnings
Brantco Technologies Inc.: PCB Assembly Both SMT,Thru Hole and Wire and Cable
Solder Training: Providing IPC certifications in IPC-610, IPC-JSTD-001, IPC-7711/7721, hands on solder training. Leadfree, lead free hands on solder training and custom classes available
Business Manager: e-con
Systems, an Electronic Design Services Company offers Design, Development and Consultancy Services in embedded domain. e-con offers services in various embedded product domains such as Wired/Wireless Networking, Consumer Appliances, Medical
Advanced International Technology: AITechnology supports the wafer back end / front end industries for custom prototype design and development including Thin Film, Wafer Dicing, Wire Bonding, and final assembly.
Selmic prototype packaging: Ceramic package, wire bond, wedge bond, gold bond, aluminum bond, ball bond, integrated circuit package, ic package, semiconductor assembly, semiconductor package, integrated circuit prototype, ic prototype, prototype assembly, semiconductor
ShenZhen XinKZhengDa Electronics Co.,Ltd: XinKeZhengDa Electronics Company Ltd. is a professional trading and kitting company for all kinds of electronic components, mainly trading in integrated circuit. The main business scope of our company is:
Welcome to REACT Corporation - Reconditioned Automatic Test Equipment A.T.E. for the printed circuit board manufacturing industry, including products from Agilent Technologies, HP, GenRad, Teradyne, and Zehntel.: Reconditioned Automatic Test Equipment A.T.E. for the printed circuit board manufacturing industry, including products from Agilent Technologies, HP, GenRad, Teradyne, and Zehntel - REACT Corporation
Ourem Microsystems Pvt. Ltd.: Electronics Design & Product Development. Design to production prototype based on Analog & Digital Electronics and microcontrollers. Starting from concept or Idea we design the schematic & develop
T | Pack: Tpack provides turnkey customised chip solutions for E-LINE and E-LAN Carrier Ethernet and Ethernet over SONET/SDH applications. Tpack solutions are based on FPGA designs with associated application software integrated and
Quik-Pak: Quik-Pak has proprietary and patented technology that enable re-configured / re-manufactured Plastic IC packages to be used primarily for IC Prototype Evaluation and / or assembly. Any existing plastic package
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