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AG Associates is one of the most famous RTP equipment manufacturers: AG Associates is one of the most famous RTP equipment manufacturers. Many Integrated Chip companies, R&D centers, Institutes all over the world have been using AG Heatpulse Systems.
Aspen Technologies: Aspen Technologies is the preferred supplier of advanced packaging and assembly services. From engineering prototypes to volume production, custom MEMS packages to Flip Chip assembly, finest-pitch wedge and gold ball
Excess Inventory: Mitkem Technologies, Inc. was established in February of 1999. A devotion to customer service and a strong work ethic has fueled Mitkem since her inception. Mitkem Technologies found its beginnings
Brantco Technologies Inc.: PCB Assembly Both SMT,Thru Hole and Wire and Cable
Business Manager: e-con
Systems, an Electronic Design Services Company offers Design, Development and Consultancy Services in embedded domain. e-con offers services in various embedded product domains such as Wired/Wireless Networking, Consumer Appliances, Medical
Advanced International Technology: AITechnology supports the wafer back end / front end industries for custom prototype design and development including Thin Film, Wafer Dicing, Wire Bonding, and final assembly.
Selmic prototype packaging: Ceramic package, wire bond, wedge bond, gold bond, aluminum bond, ball bond, integrated circuit package, ic package, semiconductor assembly, semiconductor package, integrated circuit prototype, ic prototype, prototype assembly, semiconductor
ShenZhen XinKZhengDa Electronics Co.,Ltd: XinKeZhengDa Electronics Company Ltd. is a professional trading and kitting company for all kinds of electronic components, mainly trading in integrated circuit. The main business scope of our company is:
Welcome to REACT Corporation - Reconditioned Automatic Test Equipment A.T.E. for the printed circuit board manufacturing industry, including products from Agilent Technologies, HP, GenRad, Teradyne, and Zehntel.: Reconditioned Automatic Test Equipment A.T.E. for the printed circuit board manufacturing industry, including products from Agilent Technologies, HP, GenRad, Teradyne, and Zehntel - REACT Corporation
Ourem Microsystems Pvt. Ltd.: Electronics Design & Product Development. Design to production prototype based on Analog & Digital Electronics and microcontrollers. Starting from concept or Idea we design the schematic & develop
T | Pack: Tpack provides turnkey customised chip solutions for E-LINE and E-LAN Carrier Ethernet and Ethernet over SONET/SDH applications. Tpack solutions are based on FPGA designs with associated application software integrated and
Quik-Pak: Quik-Pak has proprietary and patented technology that enable re-configured / re-manufactured Plastic IC packages to be used primarily for IC Prototype Evaluation and / or assembly. Any existing plastic package
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KEMET Featuring First-to-Market Capacitance Products at Electronica 2008: KEMET Corporation (NYSE: KEM), The Capacitance Company, is showcasing a company-record number of first-to-market capacitance products this week at Electronica 2008 in Munich, Germany. In the quarter ending September 30, 2008, KEMET has introduced 178 first...
Realtime Technologies Launches SHIMMER - a Wearable Health Sensor for Both Connected and Wireless Environments: Ireland-based Realtime Technologies, a leading provider of electronic manufacturing and design services, today launched SHIMMER(TM), a hardware research platform designed for wearable health sensing in both connected and wireless environments. SHIMMER -- which...
AT&T Expanding Wireless Coverage in Alabama; Investing More Than $29 Million This Year In The State's Wireless Network: AT&T (NYSE: T) has announced an investment of more than $29 million in the Alabama wireless network in 2007. This brings AT&T's three-year investment in Alabama to nearly $300 million. This year's investment includes the addition of new cell sites, expanded...
MathStar, Inc. Announces Exercise of Over-Allotment Option: MathStar, Inc. (Nasdaq: MATH), a fabless semiconductor company specializing in high-performance programmable logic, announced today that the underwriters of the company's recently completed public offering have exercised their entire option to purchase anadditional...
KEMET Expands Surface-Mount MLCC C0G Platform: KEMET Corporation (NYSE: KEM) is pleased to announce the release of several new MLCC products in C0G dielectric. These new additions to the company's C0G portfolio boast industry-leading capacitance values, including several first-to-market values.
Capacitance...
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