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PCB manufacturer-FINPO Electronic Co., Ltd: FINPO has 31 years of experience doing OEM / ODM service as well as the total solutions found for all our customers. With the flexible and friendly customer service, FINPO
Ultra-Low-Power (Weak Inversion) Analog ASIC Design for High-Reliablity Applications: We are an IC Design company. Our main expertise is in the area of ultra-low-power mixed-signal ASICs using Bulk/SOI CMOS, HV CMOS-compatible and BiCMOS technologies, particularly for safety critical applications.
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Nanjing Fengjie Tech. & Ind. Co., Ltd.: Our company is a famous IC producer and distributors in China. We are the whole seller of HN brand IC, exclusive distributor of Prewell Corporation (RFIC), Fortune Semiconductor Corporation
Tiempo - complex chips with ultra low power consumption: Tiempo, located in Montbonnot St-Martin, near Grenoble France, develops and commercializes a complete solution – IPs and EDA tools – for the design of innovative clockless integrated circuits.
Austria Mikro Systeme International AG : Develops and produces application-specific integrated circuits (ASICs), application-specific standard products (ASSPs) and mixed analog/digital ASICs for the automotive, communication and industrial m...
ST Microelectronics : Provide devices ranging from standard TTL logic to MPUs, to NVRAM.
Action Components and Modules Inc : Manufacturer of linear ICs, providing solutions for display, telecommunication system and terminal makers.
Clare Micronix Integrated Systems, Inc. : Developer and manufacturer of application specific integrated circuit (ASIC) and application specicfic standard products (ASSP), specializing in analog and mixed-signal solutions.
Wolfson : Design and manufacture imaging, audio and converter semiconductor devices for the PC consumer market.
ASIC Advantage, Inc : IC development, test, production, and design services. ASIC Advantage serves industries that demand the highest standards of performance,... where good is never good enough, where success is measured in ever
SolarFlare Communications, Inc : Produces 10GBase-T (10 Gig Ethernet) physical layer devices.
Advanced Micro Devices, Inc (AMD) : Produces flash memory, microprocessors (mainly x86), communications ICs, and embedded system ICs.
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TSMC Unveils First Commercial 65-Nanometer Multi-Time Programmable Non-Volatile Memory Technology: Taiwan Semiconductor Manufacturing Company, Ltd. today announced the foundry segment's first functional 65-nanometer (nm) multi-time programmable (MTP) non-volatile memory (NVM) process technology. The technology incorporates process-qualified MTP IP blocks...
Lear Reaches Agreement In Principle On Consensual Debt Restructuring: Lear Corporation, a leading global supplier of automotive seating systems, electrical distribution systems and electronic products, announced today that the Company has reached an agreement in principle regarding a consensual debt restructuring with steering...
EnerSys Enhances Lithium-Based Capabilities with Expansion of Design, Assembly and Sales Operations: EnerSys(R), the world's largest manufacturer, marketer and distributor of industrial batteries, enhanced its lithium-based capabilities with the launch of an EnerSys Advanced Systems (EAS) unit in Budapest, Hungary, in addition to an existing EAS unit located...
Statement from Visteon Corporation Welcoming General Electric to Van Buren Township: Visteon Corporation today extended its congratulations and welcome to the General Electric Company on its plans to open an advanced manufacturing technology and software center on the 265-acre Visteon Village site in Van Buren Township, Mich., which also houses...
China 3C Group Announces New Chief Financial Officer: China 3C Group ("China 3C" or the "Company") (OTC Bulletin Board: CHCG), a retailer and wholesale distributor of consumer and business products in China, today announced that it has promoted Jian Zhang to the post of Chief Financial Officer. Mr. Zhang replaces...
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