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The exclusive manfacture for AG Heatpulse 610 under the licence of Metron,an Apply Material company: Allwin21 is the exclusive licenced manufacture for AG 610,AG Heatpulse 410,AG Heatpulse 210.Allwin21 is making new AG610 machine with her innovative software and more advanced temperature measurement technology. The brand
Wafer dicing saw blades wafer dicing surfactant: Keteca USA manufactures hub style 2" dicing saw blades for wafers, ceramics and other Semiconductor materials. We also manufacture the leading brand of wafer dicing surfactant for dicing and grinding
Mirae Corp. : Test handlers, chip mounters.
TCG Inc. : Manufacturers' representatives for semiconductor process and inspection equipment. Mask alignment, contact and proximity printing, automated visual inspection, surface profiling, wafer handling and so...
Boschman Technologies : Manufacturer of auto molding and trim and form systems for the semiconductor industry.
Thin Film Equipment srl : Seller of new and used semiconductor manufacturing equipment, including sputtering and etching systems. Italy. Site lists represented companies.
4Semi : Marketplace for used semiconductor manufacturing equipment. Site includes searchable tree of available products, with descriptions, specs, photos, and asked prices.
Brewer Science Limited: Manufactures and supplies specialty chemicals for the semiconductor industry such as ARC® (Anti-Reflective Coatings), wafer bonding material, MEMS materials, Gap Fill materials for lithography and spin coaters, hotplates, cluster tools
Global Fab Surplus Semiconductor Equipment LLC: GFab's primary function is to provide access to used and surplus semiconductor equipment at significant cost savings to the production and research environment. GFab also provides services for disposition
Cpk Industries, LLC: Precision Products for Microelectronics
Semiconductor Equipment Sales & Service: Semiconductor manufacturing equipment sales & service worldwide
Semiconductor Tapes & Materials: Leading supplier of consumables for backend semiconductor processing, including UV and non-UV tapes for wafer backgrinding and dicing, grinding wheels and dicing blades.
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Raytex and Camtek Announce Cooperation Agreement: Raytex Corporation (Tokyo Stock Exchange 6672), and Camtek Ltd. jointly announced today that the two Companies have reached an agreement to collaborate in the development, production and marketing of a system for automated optical inspection of semiconductor...
Synaptics to Present at the Barclays Capital Global Technology Conference: Synaptics (Nasdaq: SYNA), a leading developer of human interface solutions for mobile computing, communications, and entertainment devices, today announced that members of the management team will present to the investment community at the Barclays Capital...
Tyco Electronics to Present at Credit Suisse 2008 Annual Technology Conference: Tyco Electronics Ltd. today announced that Chief Executive Officer Tom Lynch will present at Credit Suisse's 2008 Annual Technology Conference in Scottsdale, Ariz. on Dec. 3, 2008 at 10:00 a.m. PST.
An audio webcast of the presentation will be available...
SiliconExpert Technologies Releases Component Risk Analysis and Obsolescence Forecast Algorithm: SANTA CLARA, CA, Nov 18th. SiliconExpert Technologies, the leading provider and innovator of electronic parts management, in collaboration with University of Maryland’s CALCE, has released its component risk analysis and obsolescence forecast algorithm for...
Epson Offers Chance to Win Mentor Series Photo Trek Through 'Upgrade Your Prints' Sweepstakes: Epson, the overwhelming brand of choice among professional photographers, and The Hachette Photo/Electronics Group today announced their joint promotion available through the Hachette Photo media outlets Popular Photography, American PHOTO and PopPhoto.com...
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