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Advanced Packaging [1-10 of 10] Page 1
SMTnet
Category: Automotive
Location: United States

Offers discussion forums, directories, technical information libraries, and equipment marketplace for electronics manufacturing industry.

United States

ESEC silicon packaging
Category: Hardware\ Interconnection Systems
Location: Balzers - Liechtenstein

Develops system solutions and process technologies for the backend semiconductor industry. die bonder, wire bonder, assembly systems, semiconductor packaging 		Liechtenstein

Datacon Semiconductor Equipment Gmbh
Category: Production Equipment and Materials\ Semiconductor Processing
Location: Radfeld - Austria

Datacon is concentrating on advanced packaging solutions. A specialist for die bonding, die attach, flip chip. 		Austria

Foothill Instruments, LLC
Category: Production Equipment and Materials\ Semiconductor Processing
Location: La Canada, California - United States

Manufacturer of film thickness metrology equipment for semiconductor and related industries. 		United States

Newport Corporation
Category: Optoelectronics and Fiber\ Optics
Location: IRVINE, California - United States

Products are targeted toward laser users and those working with collimated light. 		United States

Richardson Grating Laboratory
Category: Optoelectronics and Fiber\ Optics
Location: Rochester, New York - United States

Manufacturer of diffraction gratings. Replicate from stock an inventory of master ruled and holographic gratings, plane and concave, transmission, reflection and echelle, and grisms. 		United States

Wytan
Category: Contract Manufacturers\ Printed Circuit Boards
Location: Golden, Colorado - United States

Golden, Colorado manufacturing company specializing in assembling advanced technology circuit boards. Equipment list and capabilties. 		United States

Tessera Technologies
Category: Contract Manufacturers\ Integrated Circuits and Semiconductors
Location: San Jose, California - United States

Provides intellectual property for advanced semiconductor packaging. 		United States

DDE Supermax ECAD
Category: Business Electronics\ Circuit Boards
Location: Wilsonville, Oregon - United States

PCB, MCM, and hybrid layout supports all types of designs including advanced packaging, RF, microwave, and high-speed. 		United States

Aspen Technologies
Category: Contract Manufacturers\ Integrated Circuits and Semiconductors
Location: Colorado Springs, Colorado - United States

Aspen Technologies is the preferred supplier of advanced packaging and assembly services. From engineering prototypes to volume production, custom MEMS packages to Flip Chip assembly, finest-pitch wedge and gold ball ......
United States
Advanced Packaging [1-10 of 10] Page 1
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