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Flip Chip Technologies
Category:
Contract Manufacturers\ Integrated Circuits and Semiconductors
Location: Gilbert, Arizona - United States
offers wafer bumping services, wafer-level chip-scale packaging, redistribution of peripheral pads, test die and substrates, solder alloys, technology licensing, and ......
TelExpress, Inc.
Category:
Business Electronics\ Telecommunications
Location: Archdale, North Carolina - United States
Distributor of surplus and refurbished telecommunications equipment for the Central Office.
28
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