Manufacturer of equipment for ball grid array (BGA) component handling, including removal, reballing, and alloy injection ball creation. Company also offers BGA balling and interconnection design ser...
Emphasis on on-line testing in the integration of ICs and the continuous operation of large applications such as wired, cellular and satellite telecommunication. Programme details from 1995 to present. Previous ......
24 September - 27 September 2001, Paris, France. The 7th International Workshop encompasses a series of events to discuss the essential thermal questions of microelectronics microstructures and electronic parts in ......
