Canada. Providing optical component designers with access to an wafer foundry based on Silica-on-Silicon technology for the production of planar lightwave circuits (PLC).
Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.
India born researcher Engineer on Wireless Communication, Information theory, Signal processing and mathematics. Discuss personal interest, research interest and philosophy. Also provide links and references to publications on topics including ......
Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.